• DocumentCode
    672230
  • Title

    Development of improved SSIM quality index for compressed medical images

  • Author

    Kumar, Bijendra ; Kumar, S.B. ; Kumar, Chanchal

  • Author_Institution
    Motilal Nehru Nat. Inst. of Technol., Allahabad, India
  • fYear
    2013
  • fDate
    9-11 Dec. 2013
  • Firstpage
    251
  • Lastpage
    255
  • Abstract
    This paper presents the development of improved structural similarity index (SSIM) quality assessment parameter for compressed medical images. The SSIM has been proved to be better objective quality assessment metric which exploits the structural similarity in the viewing field. In this paper, the SSIM quality index has been modified by achieving optimal value of arbitrary constant K used in SSIM index expression. The analysis has been done for three different types of medical image; MRI scan, CT scan and ultrasound image. SSIM index along with PSNR, MSE and mean-opinion-score (MOS) are computed for SPIHT compressed medical images at varying compression rates by setting values of K in the range 0.02 to 2.0. The value of K giving maximum correlation coefficient (CC) between SSIM index and MOS is selected as optimal value. It is found that optimal values of K equal to 0.5, 0.05 and 0.1 for MRI, CT scan and ultrasound images respectively.
  • Keywords
    biomedical MRI; biomedical ultrasonics; computerised tomography; data compression; image coding; medical image processing; CT scan; MOS; MRI scan; MSE; PSNR; SPIHT compressed medical images; improved SSIM quality index; improved structural similarity index quality assessment parameter; maximum correlation coefficient; mean-opinion-score; objective quality assessment metric; ultrasound image; Biomedical imaging; Computed tomography; Image coding; Indexes; Magnetic resonance imaging; PSNR; Quality assessment; CT scan; Compression Ratio (CR); MOS; MRI; MSE; PSNR; Quality Assessment; SSIM; Ultrasound;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Image Information Processing (ICIIP), 2013 IEEE Second International Conference on
  • Conference_Location
    Shimla
  • Print_ISBN
    978-1-4673-6099-9
  • Type

    conf

  • DOI
    10.1109/ICIIP.2013.6707593
  • Filename
    6707593