High efficiency integrated antennas on ultra-thin Si substrate

This work presents CMOS on-chip antennas for wireless chip-to-chip communication. In order to provide for high antenna efficiency, the antennas have been manufactured on an ultra-thin substrate with a thickness of 17.5 μm. The antennas are manufactured in the top metallization layer and are used as ground supply for the CMOS circuitry, thus requiring no dedicated chip area. Prototypes of the proposed antennas have been manufactured and measured. The results validate the suitability of the ultra-thin chip technology for efficient antenna integration.