Title :
Three dimensional printing of graded dielectrics using ultrasonic powder deposition
Author :
Roper, David A. ; Mirotznik, Mark S. ; Yarlagadda, Shridhar
Author_Institution :
Electr. & Comput. Eng., Univ. of Delaware, Newark, DE, USA
Abstract :
Here we present a new system for the fabricating of graded dielectrics within a structural composite. The system employs an ultrasonic powder deposition head to print high dielectric powders on a woven fabric composite prepreg. The eventual goal is to create nearly arbitrary 3D variations of dielectric properties within a mechanically rugged substrate.
Keywords :
dielectric materials; dielectric properties; powders; three-dimensional printing; dielectric powders; dielectric properties; graded dielectrics; mechanically rugged substrate; structural composite; three dimensional printing; ultrasonic powder deposition; woven fabric composite prepreg; Three-dimensional displays;
Conference_Titel :
Antennas and Propagation Society International Symposium (APSURSI), 2013 IEEE
Conference_Location :
Orlando, FL
Print_ISBN :
978-1-4673-5315-1
DOI :
10.1109/APS.2013.6711236
