• DocumentCode
    673765
  • Title

    Efficient Nyström solutions for electromagnetic scattering by thin conducting structures

  • Author

    Xu, Zongben ; Wang, Z.S. ; Chen, X.Z. ; Du, J.L. ; Tong, Mei Song

  • Author_Institution
    Dept. of Electron. Sci. & Technol., Tongji Univ., Shanghai, China
  • fYear
    2013
  • fDate
    7-13 July 2013
  • Firstpage
    1536
  • Lastpage
    1537
  • Abstract
    In the integral equation method for solving electromagnetic problems with thin conducting structures, there are several unfavorable factors. The individual electric field integral equation (EFIE) and magnetic field integral equation (MFIE) may deteriorate the conditioning of matrix equations due to their degeneration when the thickness reduces. Also, there are more near-interaction evaluations in filling the impedance matrix because the near-interactions between observation points and source patches are popular. In addition, many triangular meshes could have a high aspect ratio due to the small thickness and this will present a difficulty for the accurate evaluation of self- and near-interaction elements. Aiming at these factors, we develop an efficient Nyström method to solve the EM problems based on the combined field integral equation (CFIE) and a numerical example is presented to demonstrate its robustness.
  • Keywords
    electric field integral equations; electromagnetic wave scattering; impedance matrix; EFIE; MFIE; Nystrom solutions; combined field integral equation; electric field integral equation; electromagnetic problems; electromagnetic scattering; impedance matrix; magnetic field integral equation; matrix equations; thin conducting structures; triangular meshes; Equations; Green´s function methods; Impedance; Integral equations; Method of moments; Scattering; Surface impedance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium (APSURSI), 2013 IEEE
  • Conference_Location
    Orlando, FL
  • ISSN
    1522-3965
  • Print_ISBN
    978-1-4673-5315-1
  • Type

    conf

  • DOI
    10.1109/APS.2013.6711427
  • Filename
    6711427