• DocumentCode
    674330
  • Title

    Study of EMC optimization of automotive electronic components using CAE

  • Author

    Tae-Ho Kim ; Mi-ro Kim ; Byung-Jae Ahn ; Sang-Yong Jung

  • Author_Institution
    Hyundai mobis, South Korea
  • fYear
    2013
  • fDate
    26-29 Oct. 2013
  • Firstpage
    535
  • Lastpage
    538
  • Abstract
    As more vehicles become equipped with advanced electronic control systems, more consideration is needed with regards to automotive safety issues related to the effects of electromagnetic waves. Unwanted electromagnetic waves from the antenna, electricity and other electronic devices cause the performance and safety problem of automotive components. In general, Power Integrity and Signal Integrity analysis have been widely used, but these analyses have stayed PCB level. PCB base analysis is different from radiated emission TEST condition so its results are used just for reference. This paper propose EMC optimization technology using module level 3-dimensional radiation simulation process closed to fundamental test conditions. If module level EMC analysis, which is proposed in this study, is applied to all automotive electronics systems, unexpected EMC noise will be prevented.
  • Keywords
    automotive components; automotive electronics; electromagnetic compatibility; electromagnetic waves; printed circuits; CAE; EMC; PCB; antenna; automotive components; automotive electronic components; automotive electronics systems; automotive safety; electricity; electromagnetic waves; electronic control systems; electronic devices; module level 3-dimensional radiation simulation process; power integrity analysis; signal integrity analysis; Analytical models; Capacitors; Electromagnetic compatibility; Frequency measurement; Noise; Noise measurement; Probes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Machines and Systems (ICEMS), 2013 International Conference on
  • Conference_Location
    Busan
  • Print_ISBN
    978-1-4799-1446-3
  • Type

    conf

  • DOI
    10.1109/ICEMS.2013.6713127
  • Filename
    6713127