DocumentCode
674330
Title
Study of EMC optimization of automotive electronic components using CAE
Author
Tae-Ho Kim ; Mi-ro Kim ; Byung-Jae Ahn ; Sang-Yong Jung
Author_Institution
Hyundai mobis, South Korea
fYear
2013
fDate
26-29 Oct. 2013
Firstpage
535
Lastpage
538
Abstract
As more vehicles become equipped with advanced electronic control systems, more consideration is needed with regards to automotive safety issues related to the effects of electromagnetic waves. Unwanted electromagnetic waves from the antenna, electricity and other electronic devices cause the performance and safety problem of automotive components. In general, Power Integrity and Signal Integrity analysis have been widely used, but these analyses have stayed PCB level. PCB base analysis is different from radiated emission TEST condition so its results are used just for reference. This paper propose EMC optimization technology using module level 3-dimensional radiation simulation process closed to fundamental test conditions. If module level EMC analysis, which is proposed in this study, is applied to all automotive electronics systems, unexpected EMC noise will be prevented.
Keywords
automotive components; automotive electronics; electromagnetic compatibility; electromagnetic waves; printed circuits; CAE; EMC; PCB; antenna; automotive components; automotive electronic components; automotive electronics systems; automotive safety; electricity; electromagnetic waves; electronic control systems; electronic devices; module level 3-dimensional radiation simulation process; power integrity analysis; signal integrity analysis; Analytical models; Capacitors; Electromagnetic compatibility; Frequency measurement; Noise; Noise measurement; Probes;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Machines and Systems (ICEMS), 2013 International Conference on
Conference_Location
Busan
Print_ISBN
978-1-4799-1446-3
Type
conf
DOI
10.1109/ICEMS.2013.6713127
Filename
6713127
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