DocumentCode
674434
Title
A thermal model for electrothermal simulation of power modules
Author
Jinlei Meng ; Xuhui Wen ; Yulin Zhong ; Zhijie Qiu ; Liang Kong
Author_Institution
Univ. of Chinese Acad. of Sci., Beijing, China
fYear
2013
fDate
26-29 Oct. 2013
Firstpage
1635
Lastpage
1638
Abstract
A thermal model of power modules based on the physical dimension and thermal properties is proposed in this paper. The heat path in the power module is considered as a one-dimensional heat transfer in the model. The method of the parameters extraction for the model is given in the paper. With high speed and accuracy, the thermal model is suit for electrothermal simulation. The proposed model is verified by experimental results.
Keywords
circuit simulation; heat transfer; power semiconductor devices; thermal analysis; 1D heat transfer; electrothermal simulation; heat path; parameter extraction; power electronic chips; power modules; thermal model; Finite element analysis; Heat transfer; Junctions; Mathematical model; Multichip modules; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Machines and Systems (ICEMS), 2013 International Conference on
Conference_Location
Busan
Print_ISBN
978-1-4799-1446-3
Type
conf
DOI
10.1109/ICEMS.2013.6713313
Filename
6713313
Link To Document