DocumentCode
67499
Title
Novel Approach Toward Plasma Enhancement in Trench-Insulated Gate Bipolar Transistors
Author
Antoniou, M. ; Lophitis, N. ; Bauer, F. ; Nistor, I. ; Bellini, M. ; Rahimo, M. ; Amaratunga, G. ; Udrea, F.
Author_Institution
Dept. of Electr. Eng., Univ. of Cambridge, Cambridge, UK
Volume
36
Issue
8
fYear
2015
fDate
Aug. 2015
Firstpage
823
Lastpage
825
Abstract
In this letter, a trench-insulated gate bipolar transistor (IGBT) design with local charge compensating layers featured at the cathode of the device is presented and analyzed. The superjunction or reduced surface effect proves to be very effective in overcoming the inherited ON-state versus breakdown tradeoff appearing in conventional devices, such as the soft punch through plus or field stop plus (FS+) IGBTs. This design enhances the ON-state performance of the FS+IGBT by increasing the plasma concentration at the cathode side without affecting either the switching performance or the breakdown rating.
Keywords
insulated gate bipolar transistors; plasma applications; power MOSFET; power bipolar transistors; semiconductor device breakdown; breakdown rating; cathode; local charge compensating layers; plasma enhancement; superjunction power MOSFET; trench-IGBT; trench-insulated gate bipolar transistors; Cathodes; Doping; Electric breakdown; Insulated gate bipolar transistors; Logic gates; Performance evaluation; Switches; Insulated Gate Bipolar Transistor (IGBT); Insulated gate bipolar transistor (IGBT); superjunction power MOSFET; technology trade-off;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2015.2433894
Filename
7109132
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