• DocumentCode
    67499
  • Title

    Novel Approach Toward Plasma Enhancement in Trench-Insulated Gate Bipolar Transistors

  • Author

    Antoniou, M. ; Lophitis, N. ; Bauer, F. ; Nistor, I. ; Bellini, M. ; Rahimo, M. ; Amaratunga, G. ; Udrea, F.

  • Author_Institution
    Dept. of Electr. Eng., Univ. of Cambridge, Cambridge, UK
  • Volume
    36
  • Issue
    8
  • fYear
    2015
  • fDate
    Aug. 2015
  • Firstpage
    823
  • Lastpage
    825
  • Abstract
    In this letter, a trench-insulated gate bipolar transistor (IGBT) design with local charge compensating layers featured at the cathode of the device is presented and analyzed. The superjunction or reduced surface effect proves to be very effective in overcoming the inherited ON-state versus breakdown tradeoff appearing in conventional devices, such as the soft punch through plus or field stop plus (FS+) IGBTs. This design enhances the ON-state performance of the FS+IGBT by increasing the plasma concentration at the cathode side without affecting either the switching performance or the breakdown rating.
  • Keywords
    insulated gate bipolar transistors; plasma applications; power MOSFET; power bipolar transistors; semiconductor device breakdown; breakdown rating; cathode; local charge compensating layers; plasma enhancement; superjunction power MOSFET; trench-IGBT; trench-insulated gate bipolar transistors; Cathodes; Doping; Electric breakdown; Insulated gate bipolar transistors; Logic gates; Performance evaluation; Switches; Insulated Gate Bipolar Transistor (IGBT); Insulated gate bipolar transistor (IGBT); superjunction power MOSFET; technology trade-off;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2015.2433894
  • Filename
    7109132