Three-dimensional integrated optical interconnect with laser and photodetector on SOI substrate

Author

Po-Kuan Shen ; Chin-Ta Chen ; Sheng-Long Li ; Chia-Hao Chang ; Shu-Hsuan Lin ; Chia-Chi Chang ; Hsiao-Chin Lan ; Mount-Learn Wu

Author_Institution

Dept. of Opt. & Photonics, Nat. Central Univ., Jhongli, Taiwan

fYear

2013

fDate

27-30 Oct. 2013

Firstpage

1

Lastpage

2

Abstract

A three-dimensional on-chip optical interconnect with laser and photodetector is demonstrated using guided-wave silicon optical bench with 45-degree micro-reflector. Three-dimensional optical path is employed to connect laser and photodetector. The optical coupling efficiency between laser and photodetector is -1.74dB. 5-Gbps error-free data transmission with 6mA laser bias is measured.

Keywords

elemental semiconductors; integrated optics; laser cavity resonators; micro-optics; optical couplers; optical interconnections; optical waveguides; photodetectors; silicon; silicon-on-insulator; surface emitting lasers; 45-degree microreflector; SOI substrate; Si-SiO₂; VCSEL; current 6 mA; error-free data transmission; guided-wave silicon optical bench; laser; optical coupling efficiency; photodetector; three-dimensional integrated on-chip optical interconnect; Adaptive optics; Optical interconnections; Optical waveguides; Silicon; System-on-chip; Transmission line measurements; Vertical cavity surface emitting lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Microoptics Conference (MOC), 2013 18th

Conference_Location

Tokyo

Type

conf

Filename

6715061