Gate length scaling of high-k vertical MOSFET toward 20nm CMOS technology and beyond

This paper presents the gate length scaling of the Vertical MOSFET (VMOS) with high-k dielectrics for beyond 20nm CMOS technology in comparison with Double Gate MOSFET (DG) at the same Drain Induced Barrier Lowering (DIBL). The VMOS can significantly suppresses DIBL within 11mV/V caused by fringing electric field through thicker designed high-k dielectrics (EOT=1.0nm). Moreover, the VMOS can be designed by shorter gate length from 5.4 to 19nm as using higher gate dielectric constant from k=10 to k=60.