DocumentCode
676057
Title
Transmission characteristics of via holes in high-speed PCB
Author
He Xiangyang ; Lei Zhenya ; Wang Qing
Author_Institution
Sch. of Electron. Eng., Xidian Univ., Xi´an, China
Volume
02
fYear
2013
fDate
23-25 Oct. 2013
Firstpage
977
Lastpage
980
Abstract
A method of analyzing transmission characteristics of via holes in the time domain is presented in this paper. A suitable analysis model is set up using CST (Computer Simulation Technology). With theoretical analysis, the effect of via structures on signal transmission characteristics could be acquired. The simulation results show that appropriate design for via holes can reduce transmission characteristics issues effectively.
Keywords
printed circuits; time-domain analysis; transmission lines; CST; computer simulation technology; high-speed PCB; holes; signal transmission characteristics; time domain; Apertures; Delay effects; Impedance; Inductance; Parasitic capacitance; Reflection; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas & Propagation (ISAP), 2013 Proceedings of the International Symposium on
Conference_Location
Nanjing
Print_ISBN
978-7-5641-4279-7
Type
conf
Filename
6717654
Link To Document