• DocumentCode
    676128
  • Title

    Fast electromagnetic simulation by parallel MoM implemented on CUDA

  • Author

    Ming Fang ; Kai-Hong Song ; Zhi-Xiang Huang ; Xian-liang Wu

  • Author_Institution
    Key Lab. of Intell. Comput. & Signal Process., Anhui Univ., Hefei, China
  • Volume
    02
  • fYear
    2013
  • fDate
    23-25 Oct. 2013
  • Firstpage
    1268
  • Lastpage
    1271
  • Abstract
    The keys to electromagnetic simulation of arbitrary configuration of conducting surfaces by method of moments (MoM) are filling of impedance matrix elements and solving of linear equations. A CUDA (Compute Unified Device Architecture) enabled graphics processing unit (GPU) launched by NVIDIA company to accelerate implementation of the fast filling of impedance matrix in MoM based on Rao-Wilton-Glisson (RWG) basis functions was presented. Parallel LU decomposition method is applied for the solving of linear equations, and a parallel method looping over squares is proposed in CUDA parallel platform, furthermore. The GPU numerical results for a user-created benchmark structures are checked with comparison to CPU results. A noticeable speedup of the filling of impedance matrix (hundreds times) and solving of linear equations (about 10 times) is achieved due to the employing of GPU.
  • Keywords
    graphics processing units; impedance matrix; method of moments; parallel architectures; CUDA parallel platform; GPU; NVIDIA company; RWG basis functions; Rao-Wilton-Glisson basis functions; arbitrary configuration; compute unified device architecture; fast electromagnetic simulation; graphics processing unit; impedance matrix elements; linear equations; method of moments; parallel LU decomposition method; parallel MoM; user-created benchmark structures; Equations; Filling; Graphics processing units; Impedance; Mathematical model; Matrix decomposition; Method of moments; CUDA; GPU; LU Decomposition; Method of Moments;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas & Propagation (ISAP), 2013 Proceedings of the International Symposium on
  • Conference_Location
    Nanjing
  • Print_ISBN
    978-7-5641-4279-7
  • Type

    conf

  • Filename
    6717738