DocumentCode
67656
Title
Super-high-frequency SAW transducer utilizing AIN/ultrananocrystalline diamond architectures
Author
Dow, A.B.A. ; Popov, C. ; Schmid, Ulrich ; Kherani, Nazir P.
Author_Institution
Univ. of Toronto, Toronto, ON, Canada
Volume
60
Issue
8
fYear
2013
fDate
Aug-13
Firstpage
1581
Lastpage
1586
Abstract
SAW devices have been used in a variety of applications including high-volume telecommunications, electronic devices, and advanced sensors. Recently, high-bit-rate data processing in the gigahertz frequency range and ultrahigh-sensitivity sensors have called for the development of advanced SAW transducers. Because of its high acoustic velocity, ultrananocrystalline diamond (UNCD) with a crystal size of 3 to 5 nm, embedded in an amorphous carbon matrix with grain boundaries of 1 to 1.5 nm, is integrated with AlN to extend the operating frequency of SAW devices. We utilize this attractive property of UNCD through the facile synthesis of bilayer architectures consisting of sputtered AlN deposited on UNCD film. The UNCD films were synthesized using microwave plasma-enhanced chemical vapor deposition. The SAW devices were fabricated by electron beam lithography and lift off processes. The fabricated SAW nanodevices exhibit resonance frequencies up to 15.4 GHz. Multiple SAW transducers were fabricated with spatial periods ranging from 580 nm to 3.2 μm.
Keywords
aluminium compounds; diamond; electron beam lithography; plasma CVD; surface acoustic wave transducers; AlN-C; advanced sensors; amorphous carbon matrix; crystal size; electron beam lithography; electronic devices; gigahertz frequency range; grain boundary; high volume telecommunications; lift off process; microwave plasma enhanced chemical vapor deposition; size 3 nm to 5 nm; superhigh frequency SAW transducer; ultrananocrystalline diamond architecture; Diamonds; Films; III-V semiconductor materials; Surface acoustic wave devices; Surface treatment; Transducers;
fLanguage
English
Journal_Title
Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
Publisher
ieee
ISSN
0885-3010
Type
jour
DOI
10.1109/TUFFC.2013.2738
Filename
6573434
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