• DocumentCode
    677766
  • Title

    Automatic model verification for semiconductor manufacturing simulation

  • Author

    Boon Ping ; Lendermann, Gan Peter ; Scholl, Wolfgang ; Mosinski, Marcin ; Preuss, Patrick

  • Author_Institution
    JTC Summit Singapore, Singapore, Singapore
  • fYear
    2013
  • fDate
    8-11 Dec. 2013
  • Firstpage
    3858
  • Lastpage
    3865
  • Abstract
    Short Term Simulation (STS) that provides daily forecasts of work center performance has been deployed in Infineon Technologies for operational decision makings. To ensure good forecast accuracy, the STS requires high modeling fidelity, requiring good basic data quality for model building. Forecast accuracy is maintained through an Automatic Model Verification (AMV) engine. The AMV monitors and verifies discrepancies between simulation and reality for modeling elements such as process dedication, uptime, process time/throughput, sampling rate, and batch/stream size. It reports the verification results with a multi-layered view, at different levels of abstraction, and the gaps between simulation and reality are highlighted. The user can quickly identify gaps and make correction to the errors. In this paper, we give an insight to the complete workflow on how AMV helps to detect data issues, the options to resolve such issues and the positive effect to the simulation forecast quality.
  • Keywords
    decision making; digital simulation; semiconductor device manufacture; AMV engine; AMV monitors; Infineon Technologies; STS; automatic model verification; data quality; model building; operational decision makings; semiconductor manufacturing simulation; short term simulation; simulation forecast quality; work center performance daily forecasts; Computational modeling; Data models; Gallium nitride; Image color analysis; Predictive models; Semiconductor device modeling; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation Conference (WSC), 2013 Winter
  • Conference_Location
    Washington, DC
  • Print_ISBN
    978-1-4799-2077-8
  • Type

    conf

  • DOI
    10.1109/WSC.2013.6721745
  • Filename
    6721745