Title :
Message from general chair of EDAPS 2013
Abstract :
Presents the introductory welcome message from the conference proceedings.
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2013 IEEE
Conference_Location :
Nara, Japan
Print_ISBN :
978-1-4799-2313-7
DOI :
10.1109/EDAPS.2013.6724386
