• DocumentCode
    678190
  • Title

    Sponsors

  • fYear
    2013
  • fDate
    12-15 Dec. 2013
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    The conference organizers greatly appreciate the support of the various corporate sponsors listed.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2013 IEEE
  • Conference_Location
    Nara, Japan
  • Print_ISBN
    978-1-4799-2313-7
  • Type

    conf

  • DOI
    10.1109/EDAPS.2013.6724387
  • Filename
    6724387
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=678190