Title :
THz Detector with an Antenna Coupled Stacked CMOS Plasma-Wave FET
Author :
Seungwan Chai ; Sungmook Lim ; Songcheol Hong
Author_Institution :
Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol. (KAIST), Daejeon, South Korea
Abstract :
We present an antenna coupled non-resonant plasma-wave CMOS detector operating at 502 GHz, with a PMOS load and NMOS stacked structure. The gates of the NMOS plasma wave FETs, which are located in the middle of the stack, in a differential structure, are connected to the voltage- maximum points of a patch antenna. It was found that the high-input impedance of the detector causes high responsivity as the loaded Q of the antenna is enhanced and because the resultant high-voltage swing at the input allows the detector to have high responsivity. High input impedance can be achieved via using the stacked structure in conjunction with a small input transistor and the sub-threshold bias. The responsivity of stacked structure was also affected by source-drain voltage in the plasma-wave FET and active load resistor by PMOS. Therefore, it was found that the responsivity is closely related to the Vds × Ids × rload* product of the stacked structure, where Ids is the bias current, Vds is the voltage across the input NMOS plasma-wave FET and rload* is the small signal resistance of the PMOS load parallel with plasma -wave FET channel resistance. The detector shows the higher response than a cold-FET detector by one order of magnitude.
Keywords :
CMOS integrated circuits; MOSFET; microstrip antennas; plasma waves; CMOS plasma-wave FET; FET channel resistance; NMOS stacked structure; PMOS load; active load resistor; cold-FET detector; frequency 502 GHz; high-input impedance; high-voltage swing; patch antenna; plasma-wave CMOS detector; source-drain voltage; voltage- maximum points; CMOS integrated circuits; Detectors; Field effect transistors; Patch antennas; Photoconductivity; Plasma waves; Detector; THz; photocurrent; photovoltaic; plasma wave FET; plasma wave transistor; terahertz;
Journal_Title :
Microwave and Wireless Components Letters, IEEE
DOI :
10.1109/LMWC.2014.2353211