DocumentCode :
680621
Title :
Emerging reconfigurable systems: Exploring 3D FPGA architectures
Author :
Salah, Khaled ; AbdelSalam, Mohamed
Author_Institution :
Mentor Graphics, Cairo, Egypt
fYear :
2013
fDate :
15-18 Dec. 2013
Firstpage :
1
Lastpage :
4
Abstract :
Although FPGAs are a flexible alternative to ASICs, they suffer from interconnection delay which results in comparatively poor performance. Using 3D-FPGA instead of 2D-FPGA reduces the Manhattan distance between the components which results in reduction in interconnect length, delay and hence improved performance and speed. In this paper, we introduce the recent trends in 3D FPGA architectures, discuss the challenges, and display the performance evaluation metrics.
Keywords :
field programmable gate arrays; three-dimensional integrated circuits; 3D FPGA architectures; Manhattan distance; delay; interconnect length; reconfigurable systems; Delays; Design automation; Field programmable gate arrays; Routing; Switches; Three-dimensional displays; Through-silicon vias; 3D Integration; FPGA; Through Silicon Via;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronics (ICM), 2013 25th International Conference on
Conference_Location :
Beirut
Print_ISBN :
978-1-4799-3569-7
Type :
conf
DOI :
10.1109/ICM.2013.6734947
Filename :
6734947
Link To Document :
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