DocumentCode
681624
Title
Dynamic modeling and analysis of junction surfaces of robotic modules
Author
Huaizhu Li ; Yisheng Guan ; Shizhong Chen ; Pinhong Wu ; Wenqiang Wu ; Xin Chen ; Hong Zhang
Author_Institution
Sch. of Mech. & Automotive Eng., South China Univ. of Technol., Guangzhou, China
fYear
2013
fDate
12-14 Dec. 2013
Firstpage
2070
Lastpage
2075
Abstract
Junction surface plays an important role in the performance of a modular robot in terms of positioning error and system stiffness. In this paper, junction surfaces of robotic modules are modeled and analyzed based on virtual medium. The asperity of a junction surface is first made equivalent to an isotropic virtual medium layer, and the thick surface contact fractal theory is combined with the contact mechanics theory. The analytical dynamic model is thus established, by which the coupling relationship between the asperities of junction surface is successfully simulated. The fractal dimension and the scale coefficient of the equivalent junction surfaces are obtained by surface profilometer and power spectrum analysis, and the dynamic characteristic parameters of the virtual medium are calculated. Comparison result shows that the theoretical and measured modal shapes basically match, and the relative errors between the theory natural frequency and the test natural frequency of every order are less than 7.3%, which verifies the effectiveness of the dynamic model of the module junction surface.
Keywords
mechanical contact; robot dynamics; analytical dynamic model; contact mechanics theory; coupling relationship; dynamic characteristic parameters; dynamic modeling; equivalent junction surfaces; fractal dimension; isotropic virtual medium layer; modal shapes; modular robot; positioning error; power spectrum analysis; robotic modules; surface profilometer; system stiffness; thick surface contact fractal theory; Fractals; Junctions; Robots; Rough surfaces; Surface roughness; Surface topography; Surface treatment;
fLanguage
English
Publisher
ieee
Conference_Titel
Robotics and Biomimetics (ROBIO), 2013 IEEE International Conference on
Conference_Location
Shenzhen
Type
conf
DOI
10.1109/ROBIO.2013.6739774
Filename
6739774
Link To Document