DocumentCode
682506
Title
Foreword
fYear
2013
fDate
24-27 Oct. 2013
Firstpage
1
Lastpage
2
Abstract
Presents the introductory welcome message from the conference proceedings.
fLanguage
English
Publisher
ieee
Conference_Titel
Design and Technology in Electronic Packaging (SIITME), 2013 IEEE 19th International Symposium for
Conference_Location
Galati, Romania
Type
conf
DOI
10.1109/SIITME.2013.6743633
Filename
6743633
Link To Document