DocumentCode
682507
Title
Papers overview [list of papers presented]
fYear
2013
fDate
24-27 Oct. 2013
Firstpage
1
Lastpage
7
Abstract
The following topics are dealt with: electronics packaging; power electronics and microsystems packaging; assembly and manufacturing technology; electronic circuit design; electronics simulation; and electronics modelling.
Keywords
electronics packaging; micromechanical devices; network synthesis; power electronics; assembly; electronic circuit design; electronics modelling; electronics packaging; electronics simulation; manufacturing technology; microsystems packaging; power electronics;
fLanguage
English
Publisher
ieee
Conference_Titel
Design and Technology in Electronic Packaging (SIITME), 2013 IEEE 19th International Symposium for
Conference_Location
Galati
Type
conf
DOI
10.1109/SIITME.2013.6743634
Filename
6743634
Link To Document