Title :
Papers overview [list of papers presented]
Abstract :
The following topics are dealt with: electronics packaging; power electronics and microsystems packaging; assembly and manufacturing technology; electronic circuit design; electronics simulation; and electronics modelling.
Keywords :
electronics packaging; micromechanical devices; network synthesis; power electronics; assembly; electronic circuit design; electronics modelling; electronics packaging; electronics simulation; manufacturing technology; microsystems packaging; power electronics;
Conference_Titel :
Design and Technology in Electronic Packaging (SIITME), 2013 IEEE 19th International Symposium for
Conference_Location :
Galati
DOI :
10.1109/SIITME.2013.6743634
