Lead/lead free solder joints comparative electrical tests as function of microstructure and soldering thermal profile

Author

Branzei, Mihai ; Miculescu, F. ; Bibis, Adrian ; Cristea, Ionut ; Plotog, I. ; Varzaru, Gaudentiu ; Mihailescu, Bogdan

Author_Institution

Fac. of Mater. Sci. & Eng., Univ. Politeh. of Bucharest, Bucharest, Romania

fYear

2013

fDate

24-27 Oct. 2013

Firstpage

255

Lastpage

258

Abstract

The solder joints properties are determined by the specific morphology of their microstructure. In the paper are presented the comparative resistance measurements of the solder joints resulted by usage of lead/lead-free solder pastes from Vapor Phase Soldering Processes (VPS) having thermal profile with two different cooling rate, slow one (0.5 K/s) and rapid one (4 K/s). The results will be promote to develop the practical applications of this soldering technology and to contribute at realization of a data base useful for better selection of lead-free solder paste in the design and manufacturing area.

Keywords

RoHS compliance; crystal microstructure; electric properties; lead alloys; solders; cooling rate; electrical tests; lead free solder joints; leaded solder joints; microstructure profile; soldering technology; soldering thermal profile; vapor phase soldering processes; Cooling; Current measurement; Electrical resistance measurement; Microstructure; Resistance; Soldering; Voltage measurement; Solder joints resistance; VPS cooling rate;

fLanguage

English

Publisher

ieee

Conference_Titel

Design and Technology in Electronic Packaging (SIITME), 2013 IEEE 19th International Symposium for

Conference_Location

Galati

Type

conf

DOI

10.1109/SIITME.2013.6743685

Filename

6743685