DocumentCode :
68311
Title :
Uncertainty Assessment of Lossy and Dispersive Lines in SPICE-Type Environments
Author :
Manfredi, Paolo ; Ginste, Dries Vande ; De Zutter, Daniel ; Canavero, Flavio G.
Author_Institution :
Dipt. di Elettron. e Telecomun., Politec. di Torino, Turin, Italy
Volume :
3
Issue :
7
fYear :
2013
fDate :
Jul-13
Firstpage :
1252
Lastpage :
1258
Abstract :
This paper presents an alternative modeling strategy for the stochastic analysis of high-speed interconnects. The proposed approach takes advantage of the polynomial chaos framework and a fully SPICE-compatible formulation to avoid repeated circuit simulations, thereby alleviating the computational burden associated with traditional sampling-based methods such as Monte Carlo. Nonetheless, the technique offers very good accuracy and the opportunity to easily simulate complex interconnect topologies which include lossy and dispersive transmission lines, thus overcoming the limitations of previous formulations. Application examples involving the stochastic analysis of on-chip and on-board interconnects validate the methodology proposed.
Keywords :
Monte Carlo methods; circuit simulation; integrated circuit design; integrated circuit interconnections; stochastic processes; transmission lines; Monte Carlo methods; SPICE type environments; circuit simulations; dispersive transmission lines; high-speed interconnects; lossy transmission lines; on-board interconnects; on-chip interconnects; polynomial chaos framework; sampling based methods; stochastic analysis; uncertainty assessment; Circuit design; SPICE; circuit simulation; polynomial chaos (PC); stochastic analysis; transmission lines; uncertainty;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2013.2259295
Filename :
6517496
Link To Document :
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