• DocumentCode
    68311
  • Title

    Uncertainty Assessment of Lossy and Dispersive Lines in SPICE-Type Environments

  • Author

    Manfredi, Paolo ; Ginste, Dries Vande ; De Zutter, Daniel ; Canavero, Flavio G.

  • Author_Institution
    Dipt. di Elettron. e Telecomun., Politec. di Torino, Turin, Italy
  • Volume
    3
  • Issue
    7
  • fYear
    2013
  • fDate
    Jul-13
  • Firstpage
    1252
  • Lastpage
    1258
  • Abstract
    This paper presents an alternative modeling strategy for the stochastic analysis of high-speed interconnects. The proposed approach takes advantage of the polynomial chaos framework and a fully SPICE-compatible formulation to avoid repeated circuit simulations, thereby alleviating the computational burden associated with traditional sampling-based methods such as Monte Carlo. Nonetheless, the technique offers very good accuracy and the opportunity to easily simulate complex interconnect topologies which include lossy and dispersive transmission lines, thus overcoming the limitations of previous formulations. Application examples involving the stochastic analysis of on-chip and on-board interconnects validate the methodology proposed.
  • Keywords
    Monte Carlo methods; circuit simulation; integrated circuit design; integrated circuit interconnections; stochastic processes; transmission lines; Monte Carlo methods; SPICE type environments; circuit simulations; dispersive transmission lines; high-speed interconnects; lossy transmission lines; on-board interconnects; on-chip interconnects; polynomial chaos framework; sampling based methods; stochastic analysis; uncertainty assessment; Circuit design; SPICE; circuit simulation; polynomial chaos (PC); stochastic analysis; transmission lines; uncertainty;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2013.2259295
  • Filename
    6517496