DocumentCode
68311
Title
Uncertainty Assessment of Lossy and Dispersive Lines in SPICE-Type Environments
Author
Manfredi, Paolo ; Ginste, Dries Vande ; De Zutter, Daniel ; Canavero, Flavio G.
Author_Institution
Dipt. di Elettron. e Telecomun., Politec. di Torino, Turin, Italy
Volume
3
Issue
7
fYear
2013
fDate
Jul-13
Firstpage
1252
Lastpage
1258
Abstract
This paper presents an alternative modeling strategy for the stochastic analysis of high-speed interconnects. The proposed approach takes advantage of the polynomial chaos framework and a fully SPICE-compatible formulation to avoid repeated circuit simulations, thereby alleviating the computational burden associated with traditional sampling-based methods such as Monte Carlo. Nonetheless, the technique offers very good accuracy and the opportunity to easily simulate complex interconnect topologies which include lossy and dispersive transmission lines, thus overcoming the limitations of previous formulations. Application examples involving the stochastic analysis of on-chip and on-board interconnects validate the methodology proposed.
Keywords
Monte Carlo methods; circuit simulation; integrated circuit design; integrated circuit interconnections; stochastic processes; transmission lines; Monte Carlo methods; SPICE type environments; circuit simulations; dispersive transmission lines; high-speed interconnects; lossy transmission lines; on-board interconnects; on-chip interconnects; polynomial chaos framework; sampling based methods; stochastic analysis; uncertainty assessment; Circuit design; SPICE; circuit simulation; polynomial chaos (PC); stochastic analysis; transmission lines; uncertainty;
fLanguage
English
Journal_Title
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
2156-3950
Type
jour
DOI
10.1109/TCPMT.2013.2259295
Filename
6517496
Link To Document