Effects of process on interfacial adhesion strength of Ag-Si for crystalline silicon solar cells

The aim of this work is to investigate the effect of process on interfacial adhesion strength of Ag/Si for crystalline silicon solar cells. In this study, the width and thickness of busbar, the thickness of ribbon, and the soldering time and temperature during soldering process are investigated. Through a series of experiments, some meaningful conclusions which agreed with practical production can be summarized as follows: the thicker and wider the busbar is, the larger the adhesion force is; the thicker and stiffer the ribbon is, the smaller the adhesion force is; short soldering time and low soldering temperature are beneficial to enhancing the adhesion strength. These results have important guiding significance for improving solar cell manufacturing process and further enhancing the reliability of crystalline silicon solar cell.