DocumentCode :
683193
Title :
Low cost Rear Ag paste using doping silver plated-coated Copper and Tin powder under N2 protection firing
Author :
Jing Yang ; Wenzhong Shen ; Lingjun Zhang ; Xusheng Wang ; Yanbin Xue ; Yanqi Li
Author_Institution :
Canadian Solar Inc., Suzhou, China
fYear :
2013
fDate :
16-21 June 2013
Firstpage :
2292
Lastpage :
2294
Abstract :
Low cost Rear Ag paste is made by silver plated-coated Copper and Tin powder to replace part of pure Ag powder in the paste to reduce the cost of solar cell manufacture and also improve the adhesion of the solar cell busbar. The key issue to use Ag coated copper and tin is the oxidization of cooper and tin during the drying and firing process which will reduce the solderability and adhesion by using this system. We use N2 protection during drying and firing process to prevent the oxidization of cooper and tin. Therefore, the solderability and adhesion has been increased a lot to achieve the industry testing standard. Also Rs reduction is also a big achievement for this paste system.
Keywords :
adhesion; copper; doping; drying; firing (materials); silver; solar cells; tin; Ag; adhesion; copper oxidization; cost reduction; doping silver plated-coated copper-tin powder; drying process; firing process; industry testing standard; low-cost rear silver paste; nitrogen protection firing; solar cell busbar adhesion; solar cell manufacture; solderability; Adhesives; Copper; Firing; Photovoltaic cells; Powders; Silicon; Tin; Ag coated Copper; Rear Ag; Tin powder; photovoltaic cells;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Specialists Conference (PVSC), 2013 IEEE 39th
Conference_Location :
Tampa, FL
Type :
conf
DOI :
10.1109/PVSC.2013.6744935
Filename :
6744935
Link To Document :
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