DocumentCode :
683314
Title :
Laminated solar panels for space using multi-cell transparent covers
Author :
Wrosch, Matthew ; Walmsley, Nicholas ; Stern, Theodore ; Hausgen, Paul ; Wilt, David ; Jenkins, Phillip
Author_Institution :
Vanguard Space Technol., Inc., San Diego, CA, USA
fYear :
2013
fDate :
16-21 June 2013
Firstpage :
2809
Lastpage :
2811
Abstract :
An approach to laying down, interconnecting, and encapsulating a space solar panel module is described that uses large-area multi-cell transparent covers. Coverglass replacement materials were evaluated and tested in a variety of environments, including a flight test on MISSE-7, and found to be durable in the LEO environment, with approaches to extending durability to GEO and other high radiation environments. The multi-cell cover approach enables assembling advanced cells, such as IMM, into a thin array using a laminating approach that implements co-planar front contact cells with thermosonic wire bonding interconnection. Coupons of the encapsulated panels were fabricated and found to have good durability in thermal cycling.
Keywords :
durability; integrated circuit interconnections; laminations; lead bonding; solar cell arrays; solar power satellites; space vehicle electronics; GEO environment; IMM; LEO environment; MISSE-7; advanced cell assembling; coplanar front contact cells; coverglass replacement materials; encapsulation; flight test; high radiation environments; laminated solar panels; large-area multicell transparent covers; multicell cover approach; space solar panel module; thermal cycling; thermosonic wire bonding interconnection; Assembly; Laboratories; Lamination; Low earth orbit satellites; Photovoltaic cells; Substrates; encapsulated solar panels; inverted metamorphic cells; solar cell assembly; space environmental durability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Specialists Conference (PVSC), 2013 IEEE 39th
Conference_Location :
Tampa, FL
Type :
conf
DOI :
10.1109/PVSC.2013.6745056
Filename :
6745056
Link To Document :
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