DocumentCode
683448
Title
Module interconnection of both sides-contacted silicon solar cells by screen-printing
Author
Petermann, Jan Hendrik ; Schulte-Huxel, Henning ; Steckenreiter, Verena ; Gogolin, Ralf ; Eidelloth, Stefan ; Dullweber, Thorsten ; Kajari-Schroder, Sarah ; Brendel, Rolf
Author_Institution
Inst. for Solar Energy Res. Hamelin (ISFH), Emmerthal, Germany
fYear
2013
fDate
16-21 June 2013
Firstpage
3448
Lastpage
3453
Abstract
We demonstrate the module interconnection by means of screen printing. The metallization paste is printed over the edge of five heterojunction solar cells. This connects the frontside of a cell to an underlying Al-patterned rear-side contact of the neighboring cell. All cell interconnections are realized in a single printing step. Encapsulated modules reach open circuit voltages up to 683 mV per cell and designated area conversion efficiencies up to 17.0 %. The designated module area is 82 cm2. We eliminate shunts that originate from laser scribing to reach this efficiency. Quantitative dark lock in thermography images and I-V curve modeling of the shunting losses lead the way.
Keywords
elemental semiconductors; infrared imaging; printing; silicon; solar cells; I-V curve modeling; Si; aluminium-patterned rear-side contact; cell interconnections; encapsulated modules; heterojunction solar cells; metallization paste; module interconnection; open circuit voltages; printing step; quantitative dark lock; screen-printing; shunting losses; sides-contacted silicon solar cells; thermography images; voltage 683 mV; Glass; Integrated circuit interconnections; Lasers; Passivation; Photovoltaic cells; Resistance; Silicon; Hybrid silicon; heterojunction; module interconnection; module level processing; screen-printing;
fLanguage
English
Publisher
ieee
Conference_Titel
Photovoltaic Specialists Conference (PVSC), 2013 IEEE 39th
Conference_Location
Tampa, FL
Type
conf
DOI
10.1109/PVSC.2013.6745190
Filename
6745190
Link To Document