Title :
A mold flow model with method of cells to better understand IC packaging
Author :
Low, B.Y. ; Teh, Susanto ; Pei-Fan Tong ; Zhao, S.F.
Author_Institution :
Freescale Semicond., Petaling Jaya, Malaysia
Abstract :
A mold flow filling model by using on the concepts of method of cells and the principles of transport phenomena is developed to understand the mold flow and the forces on die/flag. A model representation for a LQFP package has been developed. It is user friendly to study the flow behavior of LQFP package with various downset. In a separate study, a parametric DOE study using FEM (Finite Element Method) MOLD FLOW model was conducted to understand the flow pattern as effect of package size, flag size, die size and downset.
Keywords :
finite element analysis; integrated circuit packaging; moulding; FEM; IC packaging; LQFP package; finite element method; mold flow filling model; mold flow model; parametric DOE study; Equations; Finite element analysis; Force; Mathematical model; Viscosity; Wires;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th
Conference_Location :
Singapore
Print_ISBN :
978-1-4799-2832-3
DOI :
10.1109/EPTC.2013.6745723
