DocumentCode :
683627
Title :
2D/3D cohesive zone modeling of a mixed-mode delamination experiment
Author :
Bingbing Zhang ; Daoguo Yang ; Ernst, L.
Author_Institution :
Guilin Univ. of Electron. Technol., Guilin, China
fYear :
2013
fDate :
11-13 Dec. 2013
Firstpage :
264
Lastpage :
269
Abstract :
2D/3D cohesive zone modeling of Xiao´s mixed-mode delamination experiment (2012) is performed. In particular the suitability of ANSYS cohesive elements CONTA171/173 for delamination modeling of EMC-CU interfaces is tested. For a Mixed Mode Delamination test with narrow samples, a comparison of the 2D/3D simulation results and the experimental data shows that 2D modeling is appropriate if a plane stress approximation is chosen. The position of the current crack length is found near the end of the active zone of the cohesive elements.
Keywords :
adhesion; delamination; electronics packaging; 2D cohesive zone modeling; 3D cohesive zone modeling; ANSYS cohesive element; CONTA171/173; EMC-CU interface; mixed mode delamination experiment; Delamination; Finite element analysis; Loading; Simulation; Solid modeling; Stress; Three-dimensional displays;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th
Conference_Location :
Singapore
Print_ISBN :
978-1-4799-2832-3
Type :
conf
DOI :
10.1109/EPTC.2013.6745725
Filename :
6745725
Link To Document :
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