A case study of package delamination with combination of EDX and MiniSIMS

Author

Huan Xu ; Haishu Zhang ; Ming Xue

Author_Institution

Infineon Technol. Asia Pacific, Singapore, Singapore

fYear

2013

fDate

11-13 Dec. 2013

Firstpage

403

Lastpage

406

Abstract

A case study for delamaination surface is provided by combination of EDX and MiniSIMS. EDX can provide near surface composition analysis up to 3 μm while MiniSIMS can give nanometer thickness surface characterization with molecular and structural information at ppm sensitivity. This combination is crucial to find the root cause for the delamination, a common failure mode observed in the IC package. This method is easy for the industrial user to find the root cause especially for the over oxidation on the leadframe, contamination etc. efficiently.

Keywords

X-ray chemical analysis; contamination; delamination; failure analysis; integrated circuit packaging; oxidation; surface composition; EDX; IC package; MiniSIMS; common failure mode; contamination; delamaination surface; lead frame; molecular information; nanometer thickness surface characterization; near surface composition analysis; oxidation; package delamination; ppm sensitivity; structural information; Compounds; Delamination; Instruments; Lead; Oxidation; Silver; Surface contamination;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th

Conference_Location

Singapore

Print_ISBN

978-1-4799-2832-3

Type

conf

DOI

10.1109/EPTC.2013.6745751

Filename

6745751