Title :
A case study of package delamination with combination of EDX and MiniSIMS
Author :
Huan Xu ; Haishu Zhang ; Ming Xue
Author_Institution :
Infineon Technol. Asia Pacific, Singapore, Singapore
Abstract :
A case study for delamaination surface is provided by combination of EDX and MiniSIMS. EDX can provide near surface composition analysis up to 3 μm while MiniSIMS can give nanometer thickness surface characterization with molecular and structural information at ppm sensitivity. This combination is crucial to find the root cause for the delamination, a common failure mode observed in the IC package. This method is easy for the industrial user to find the root cause especially for the over oxidation on the leadframe, contamination etc. efficiently.
Keywords :
X-ray chemical analysis; contamination; delamination; failure analysis; integrated circuit packaging; oxidation; surface composition; EDX; IC package; MiniSIMS; common failure mode; contamination; delamaination surface; lead frame; molecular information; nanometer thickness surface characterization; near surface composition analysis; oxidation; package delamination; ppm sensitivity; structural information; Compounds; Delamination; Instruments; Lead; Oxidation; Silver; Surface contamination;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th
Conference_Location :
Singapore
Print_ISBN :
978-1-4799-2832-3
DOI :
10.1109/EPTC.2013.6745751
