Title :
Reliability study on through mold via (TMV) for 3D microelectronic packaging under thermal and moisture loadings
Author :
Zhaohui Chen ; Ser Choong Chong ; Boyu Zheng ; Boo Yang Jung ; Tai Chong Chai ; Xiaowu Zhang
Author_Institution :
Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
Abstract :
Through mold via (TMV) provides a potential solution for the 3D microelectronic packaging. The reliability of the TMV is one of the major concerns during its applications. In this paper, the reliability of the TMV structure used for the embedded wafer level packaging (eWLP) was studied by the finite element simulation under the moisture 85°C/85RH, reflow and thermal cycling loading conditions. Fracture mechanics was used to calculate the strain energy release rate of the delamination between the plating copper and molding compound. The effects of the material properties and structure parameters were examined by the simulation results. The efforts can provide some guidelines for the reliability design of the 3D microelectronic packaging with TMVs.
Keywords :
delamination; finite element analysis; fracture mechanics; integrated circuit reliability; moisture; reflow soldering; three-dimensional integrated circuits; wafer level packaging; 3D microelectronic packaging; TMV reliability; TMV structure; delamination; eWLP; embedded wafer level packaging; finite element simulation; fracture mechanics; material properties; molding compound; plating copper; reflow; strain energy release rate; structure parameters; thermal cycling loading conditions; through mold via; Compounds; Copper; Delamination; Loading; Moisture; Strain; Stress;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th
Conference_Location :
Singapore
Print_ISBN :
978-1-4799-2832-3
DOI :
10.1109/EPTC.2013.6745775
