Reliability study on through mold via (TMV) for 3D microelectronic packaging under thermal and moisture loadings

Author

Zhaohui Chen ; Ser Choong Chong ; Boyu Zheng ; Boo Yang Jung ; Tai Chong Chai ; Xiaowu Zhang

Author_Institution

Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore

fYear

2013

fDate

11-13 Dec. 2013

Firstpage

524

Lastpage

529

Abstract

Through mold via (TMV) provides a potential solution for the 3D microelectronic packaging. The reliability of the TMV is one of the major concerns during its applications. In this paper, the reliability of the TMV structure used for the embedded wafer level packaging (eWLP) was studied by the finite element simulation under the moisture 85°C/85RH, reflow and thermal cycling loading conditions. Fracture mechanics was used to calculate the strain energy release rate of the delamination between the plating copper and molding compound. The effects of the material properties and structure parameters were examined by the simulation results. The efforts can provide some guidelines for the reliability design of the 3D microelectronic packaging with TMVs.

Keywords

delamination; finite element analysis; fracture mechanics; integrated circuit reliability; moisture; reflow soldering; three-dimensional integrated circuits; wafer level packaging; 3D microelectronic packaging; TMV reliability; TMV structure; delamination; eWLP; embedded wafer level packaging; finite element simulation; fracture mechanics; material properties; molding compound; plating copper; reflow; strain energy release rate; structure parameters; thermal cycling loading conditions; through mold via; Compounds; Copper; Delamination; Loading; Moisture; Strain; Stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th

Conference_Location

Singapore

Print_ISBN

978-1-4799-2832-3

Type

conf

DOI

10.1109/EPTC.2013.6745775

Filename

6745775