• DocumentCode
    68369
  • Title

    Multiphysics Analysis of Plug-In Connector Under Steady and Short Circuit Conditions

  • Author

    Xiangyu Guan ; Naiqiu Shu ; Bing Kang ; Minghan Zou

  • Author_Institution
    Sch. of Electr. Eng., Wuhan Univ., Wuhan, China
  • Volume
    5
  • Issue
    3
  • fYear
    2015
  • fDate
    Mar-15
  • Firstpage
    320
  • Lastpage
    327
  • Abstract
    With the aim of providing an effective method for optimal design and condition monitoring of the plug-in connector used in gas-insulated switchgears, a 3-D coupled field finite-element method model has been developed for analyzing the electrical, thermal, and mechanical behaviors of a plug-in connector under steady and short circuit conditions. Contact resistance and electromagnetic repulsion force are considered by modeling an equivalent contact bridge between contact interfaces. Electromagnetic force and temperature derived from electromagnetic-thermal coupled field calculation are used as the load inputs in thermal-mechanical coupled field analysis. The validity of the calculation model is demonstrated by temperature rise experiments and comparing with other closed formulas. Dynamic behaviors of a plug-in connector under short circuit conditions have been also analyzed.
  • Keywords
    contact resistance; electric connectors; electromagnetic forces; finite element analysis; gas insulated switchgear; short-circuit currents; 3-D coupled field finite-element method model; contact interfaces; contact resistance; electromagnetic repulsion force; electromagnetic-thermal coupled field calculation; equivalent contact bridge; gas-insulated switchgears; multiphysics analysis; plug-in connector; short-circuit currents; steady circuit conditions; temperature rise experiments; Conductors; Connectors; Contact resistance; Electromagnetic forces; Force; Coupled field; finite-element method (FEM); plug-in connector; short-circuit currents; temperature rise; temperature rise.;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2015.2396197
  • Filename
    7042768