Title :
Sandwich-structured polyaniline-graphene-polyaniline two-dimensional hybrid sheets for polymer nanocomposites with high dielectric constant and low dielectric loss
Author :
Xingyi Huang ; Mi Li ; Pingkai Jiang ; Tanaka, T.
Author_Institution :
Dept. of Polymer Sci. & Eng., Shanghai Jiao Tong Univ., Shanghai, China
Abstract :
Novel poly(methyl methacrylate) (PMMA) nanocomposites with high dielectric constant and low loss were successfully fabricated by using sandwich-structured polyaniline-graphene-polyaniline (rPANI-GS-rPANI) hybrids sheets as fillers. The hybrid sheets were obtained by two steps: aniline was first in situ polymerized on both surfaces of graphene oxide (GO) sheets and then the PANI-GS-PANI sheets were reduced by hydrazine. The fully reduced hybrid sheets were denoted as rPANI-GS-rPANI, which exhibit an insulator-conductor-insulator sandwich structure. It was found that, the rPANI-GS-rPANI based PMMA nanocomposites not only have high dielectric constant but also show a low loss. For instance, the dielectric constant and dielectric loss of the nanocomposite are around 28 and 0.05 at 1 MHz, respectively, when the volume ratio of GS to PMMA is 6 vol%. This study not only provides a new way to prepare polymer nanocomposites with high permittivity and low dielectric loss, but also expands the application space of graphene based fillers.
Keywords :
dielectric losses; filled polymers; graphene; nanocomposites; nanofabrication; organic-inorganic hybrid materials; permittivity; polymerisation; sheet materials; 2D sandwich structured polyaniline graphene polyaniline hybrid sheets; C; GS; PMMA nanocomposites fabrication; aniline; dielectric constant; dielectric loss; frequency 1 MHz; graphene based fillers; graphene oxide sheets; hydrazine; in situ polymerization; insulator-conductor-insulator sandwich structure; permittivity; poly(methyl methacrylate); polymer nanocomposites preparation; rPANI-GS-rPANI hybrid sheets; Dielectric constant; Dielectric losses; Graphene; Nanocomposites; Polymers;
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on
Conference_Location :
Shenzhen
DOI :
10.1109/CEIDP.2013.6747078