DocumentCode :
683878
Title :
Electrical tree formation as a measure of degradation resistance in polymeric materials for HVDC applications
Author :
Le Wang ; Xiangrong Chen ; Libin Hu ; Gubanski, Stanislaw ; Blennow, J??rgen
Author_Institution :
Dept. Mater. & Manuf. Technol., Chalmers Univ. of Technol., Gothenburg, Sweden
fYear :
2013
fDate :
20-23 Oct. 2013
Firstpage :
510
Lastpage :
513
Abstract :
In the framework of elaborating a methodology for testing the resistance to electrical treeing of polyethylene (PE) for HVDC applications, electrical tree inception tests were performed before and after a thermal ageing on XLPE samples. For this purpose test objects of wire-plane electrode geometry were exposed to various voltage regimes. The obtained results show that a DC pre-stress followed by an application of voltage pulses of opposite polarity appeared most successful for a repeatable inception of electrical trees in the studied materials. Thin tree filaments were formed, distributing randomly at the vicinity of the wire electrode (i.e. high voltage electrode). More trees and longer branches were found in the samples having longer thermal ageing period. These results correlate well with results of in parallel performed tree inception tests under AC voltage ramping. It is therefore postulated that an AC electrical tree inception test can successfully be used for evaluating degradation resistance of materials for HVDC applications.
Keywords :
HVDC power transmission; XLPE insulation; ageing; polymers; trees (electrical); AC electrical tree inception test; AC voltage ramping; DC pre-stress; HVDC applications; XLPE samples; degradation resistance; electrical tree formation; opposite polarity; polyethylene; polymeric materials; thermal ageing; voltage pulses; wire electrode; wire-plane electrode geometry; Aging; Electrodes; HVDC transmission; Materials; Microscopy; Resistance; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on
Conference_Location :
Shenzhen
Type :
conf
DOI :
10.1109/CEIDP.2013.6747433
Filename :
6747433
Link To Document :
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