DocumentCode
684107
Title
Thermally stimulated current and dielectric studies of liquid crystal composites
Author
Naikui Gao ; Chun Wu ; Wenxi Zhang ; Chi Chen ; Haiyun Jin ; Wentao Ji
Author_Institution
State Key Lab. of Electr. Insulation & Power Equip., Xi´an Jiaotong Univ., Xi´an, China
fYear
2013
fDate
20-23 Oct. 2013
Firstpage
210
Lastpage
213
Abstract
Recently, composite materials of liquid crystal polymer (LCP) and inorganic filler attracted the attention of the electrical industry. In this research, the relationships between thermally stimulated current (TSC) of liquid crystal (LC) composites and the polarization temperature (Tp), polarization voltage (Vp) and heating rate (β) were investigated respectively. The variation of trap levels and trapped charges under different experimental conditions were calculated and analyzed. Trap levels of the peaks in temperature range (-60°C~150°C) were about 0.2eV, 0.9~1.5eV and 2.0~2.5eV. In addition, the dielectric spectrum test was performed on LC composites. Permittivity (εr) changed little (3.4~3.9) in frequency range of 20Hz~106Hz and temperature range -60°C ~100°C, but increased sharply when temperature was above 140°C. The values of loss (tanδ) increased sharply in low frequencies (≤ 20Hz) and high temperatures (≥ 130°C) region. The peak of tanδ shifts to higher temperatures with frequency increasing and to higher frequencies with temperature increasing.
Keywords
composite insulating materials; composite materials; liquid crystal polymers; permittivity; LCP; TSC; composite materials; dielectric spectrum test; electron volt energy 0.9 eV to 1.5 eV; electron volt energy 2.0 eV to 2.5 eV; frequency 20 Hz to 106 Hz; inorganic filler; liquid crystal composites; liquid crystal polymer; polarization temperature; polarization voltage; temperature -60 degC to 150 degC; thermally stimulated current; trap levels; trapped charges; Dielectrics; Heating; Materials; Spectroscopy; Temperature distribution; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on
Conference_Location
Shenzhen
Type
conf
DOI
10.1109/CEIDP.2013.6748149
Filename
6748149
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