• DocumentCode
    684112
  • Title

    Preparation and properties of PI-EP/SiO2-Al2O3 composite material

  • Author

    Yufei Chen ; Zhongzhen Bian ; Qiwang Dai ; Liping Wang ; Zuoyu Wu

  • Author_Institution
    Coll. of Mater. Sci. & Eng., Harbin Univ. of Sci. & Technol., Harbin, China
  • fYear
    2013
  • fDate
    20-23 Oct. 2013
  • Firstpage
    866
  • Lastpage
    870
  • Abstract
    In this study, polyimide (PI)-epoxy resin (EP) polymer matrix was prepared from 3,3´-diethyl-4,4´-diamino diphenyl methane (DEDADPM), benzophenone tetracarboxylic acid dianhydride (BTDA) and EP (E-51), through thermal imide process, and then the nano-SiO2 and Al2O3 were doped into the PI-EP polymer matrix with Sol-gel method, prepared a series of different contents of inorganic components nano-composite materials. Morphology characterization and properties of the composite were discussed, including structure, uniformity and dispersion of inorganic phase as well as shear strength and breakdown strength of composite. And influencing factors were composed of the contents and mass ratio of inorganic components. It indicated that imidization of composite was complete in FT-IR spectra, and Si-O-Si and Al-O-Al bonds existed in PI-EP/SiO2-Al2O3 composite material. There were linkages between polyimide matrix and nano-particles. And, the result of X-ray diffraction (XRD) has been seen that crystallinity existed in PI-EP/SiO2-Al2O3 film. Results of diversified test indicated that inorganic contents and mass proportion of inorganic components could influence shear strength and breakdown strength of composite. When the mass ratio of SiO2/Al2O3 was 3:1 and total content of inorganic components reached 5wt% its breakdown strength was the most outstanding and attained 208MV/mm and increased 20% than that of polymer matrix. When the mass ratio of SiO2/Al2O3 was 0:1 and total content of inorganic components reached 5wt% the shear strength of PI-EP/SiO2-Al2O3 was the highest among the samples and reached 11.9 MPa, which was 70% higher than that of PI-EP (7 MPa).
  • Keywords
    Fourier transform spectra; X-ray diffraction; aluminium compounds; infrared spectra; nanocomposites; nanoparticles; polymer films; resins; scanning electron microscopy; silicon compounds; sol-gel processing; Al-O-Al bonds; Al2O3; BTDA; DEDADPM; E-51; FT-IR spectra; PI-EP polymer matrix; PI-EP-SiO2-Al2O3 film; PI-epoxy resin polymer matrix; Si-O-Si bonds; SiO2; X-ray diffraction; XRD; benzophenone tetracarboxylic acid dianhydride; breakdown strength; imidization; inorganic components; inorganic phase; mass ratio; morphology characterization; nanocomposite materials; nanoparticles; polyimide-EP polymer matrix; shear strength; sol-gel method; thermal imide process; Aluminum oxide; Electric breakdown; Films; Nanocomposites; Polyimides;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on
  • Conference_Location
    Shenzhen
  • Type

    conf

  • DOI
    10.1109/CEIDP.2013.6748160
  • Filename
    6748160