Characteristic and properties of nano-SiO2-Al2O3/EP-PU composite

Author

Yufei Chen ; Caiwei Lin ; Liping Wang ; Zuoyu Wu ; Yong Fan ; Qingquan Lei

Author_Institution

Coll. of Mater. Sci. & Eng., Harbin Univ. of Sci. & Technol., Harbin, China

fYear

2013

fDate

20-23 Oct. 2013

Firstpage

842

Lastpage

845

Abstract

Epoxy resin (EP) and polyurethane (PU) matrix had an outstanding performance. They were widely used in the aerospace field and became the most popular polymer matrix. In this article, precursor of EP-PU was prepared by epoxy as a matrix, polyurethane as toughening agent, MTHPA as the curing agent. The mass ratio of the PU was 30wt%in this system. SiO₂-Al₂O₃/EP-PU nano-composite material was synthesized, PU-EP as organic precursor, nano-SiO₂ and nano-Al₂O₃ as filler. FT-IR and SEM were used as microstructure analysis of SiO₂-Al₂O₃/EP-PU composite, and the results indicated that new adsorption peaks appeared in FT-IR spectra, inorganic components could uniformly disperse in the polymer matrix in SEM photos. When inorganic component content was 10wt% and the mass ratio of SiO₂ and Al₂O₃ was 4.5:5.5, mechanical properties of SiO₂-Al₂O₃/EP-PU suggested that shearing strength was 28.5MPa, breakdown field was 15kV/mm. The properties could meet the requirement of insulating material.

Keywords

Fourier transform spectra; alumina; infrared spectra; nanocomposites; polymers; resins; scanning electron microscopy; silicon compounds; EP; EP-PU nanocomposite material; FT-IR spectra; MTHPA; PU; SEM; aerospace field; breakdown field; epoxy resin; inorganic component; insulating material; mechanical properties; nanocomposite material; polymer matrix; polyurethane matrix; Absorption; Aluminum oxide; Electric breakdown; Epoxy resins; Polymers; Vibrations; epoxy resin; mechanical properties; nano-Al2O3; nano-SiO2; polyurethane;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on

Conference_Location

Shenzhen

Type

conf

DOI

10.1109/CEIDP.2013.6748233

Filename

6748233