DocumentCode
684197
Title
Study on the relationship between decomposition characteristic components of SF6 and partial discharge quantities
Author
Fuping Zeng ; Ju Tang ; Xiaoxing Zhang ; Jianyu Pan ; Qiang Yao ; Cunchao Wang
Author_Institution
State Key Lab. of Power Transm. Equip. & Syst. Security & New Technol., Chongqing, China
fYear
2013
fDate
20-23 Oct. 2013
Firstpage
1157
Lastpage
1160
Abstract
To get relationship between SF6 decomposition characteristic and partial discharge capacity or discharging repetition rate, needle-plate electrode was used to simulate out-thrust insulation fault and serials of experiments were conducted. The result showed that: since the number of C atoms from stainless steel surface and content of trace H2O and O2 in gas chamber were limited, the decomposed component concentration and its effective formation rate appeared “Logistic Population Model” growth trend with the enhancement of per second discharging capacity (Qsec). It means they present “S”-curve increase with Qsec. Hence, this paper proposed C(S02F2)/C(SOF2) as the characteristic ratio (ER) to represent partial discharge energy. Besides, it defined effective energy characteristic ratio (ERRMS) and provided the relationship between ERrms and Qsec. It further obtained relationship mathematic expression between them, which could effectively show the variance regularity of partial discharge energy with Qsec.
Keywords
SF6 insulation; decomposition; electrodes; insulation; partial discharges; stainless steel; ERRMS; H2O; O2; SF6; decomposed component concentration; decomposition characteristic; discharging repetition rate; effective energy characteristic ratio; gas chamber; logistic population; needle-plate electrode; out-thrust insulation fault; partial discharge capacity; partial discharge energy; partial discharge quantity; stainless steel surface; variance regularity; Correlation; Discharges (electric); Electrodes; Erbium; Partial discharges; Sulfur hexafluoride; Water;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on
Conference_Location
Shenzhen
Type
conf
DOI
10.1109/CEIDP.2013.6748286
Filename
6748286
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