• DocumentCode
    684197
  • Title

    Study on the relationship between decomposition characteristic components of SF6 and partial discharge quantities

  • Author

    Fuping Zeng ; Ju Tang ; Xiaoxing Zhang ; Jianyu Pan ; Qiang Yao ; Cunchao Wang

  • Author_Institution
    State Key Lab. of Power Transm. Equip. & Syst. Security & New Technol., Chongqing, China
  • fYear
    2013
  • fDate
    20-23 Oct. 2013
  • Firstpage
    1157
  • Lastpage
    1160
  • Abstract
    To get relationship between SF6 decomposition characteristic and partial discharge capacity or discharging repetition rate, needle-plate electrode was used to simulate out-thrust insulation fault and serials of experiments were conducted. The result showed that: since the number of C atoms from stainless steel surface and content of trace H2O and O2 in gas chamber were limited, the decomposed component concentration and its effective formation rate appeared “Logistic Population Model” growth trend with the enhancement of per second discharging capacity (Qsec). It means they present “S”-curve increase with Qsec. Hence, this paper proposed C(S02F2)/C(SOF2) as the characteristic ratio (ER) to represent partial discharge energy. Besides, it defined effective energy characteristic ratio (ERRMS) and provided the relationship between ERrms and Qsec. It further obtained relationship mathematic expression between them, which could effectively show the variance regularity of partial discharge energy with Qsec.
  • Keywords
    SF6 insulation; decomposition; electrodes; insulation; partial discharges; stainless steel; ERRMS; H2O; O2; SF6; decomposed component concentration; decomposition characteristic; discharging repetition rate; effective energy characteristic ratio; gas chamber; logistic population; needle-plate electrode; out-thrust insulation fault; partial discharge capacity; partial discharge energy; partial discharge quantity; stainless steel surface; variance regularity; Correlation; Discharges (electric); Electrodes; Erbium; Partial discharges; Sulfur hexafluoride; Water;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on
  • Conference_Location
    Shenzhen
  • Type

    conf

  • DOI
    10.1109/CEIDP.2013.6748286
  • Filename
    6748286