DocumentCode :
684200
Title :
Processing LDPE-EVA blend with montmorillonite and silica nanoparticles
Author :
Guastavino, F. ; Della Giovanna, L. ; Ratto, A. ; Torello, E. ; Tiemblo Magro, P. ; Garcia Garcia, N.
Author_Institution :
Dept. of Electr., Electron. Telecommun. Eng. & Naval Archit., Univ. of Genova, Genoa, Italy
fYear :
2013
fDate :
20-23 Oct. 2013
Firstpage :
547
Lastpage :
550
Abstract :
This study focuses on blends with thermoplastic polymers matrices. The nanocomposites blends based on polyolefins could represents a new class of insulating materials with low environmental impact and good electrical performances. The materials object of this study have been prepared by adding different kinds and percentage of nanofillers as montmorillonite and silica to a thermoplastic polymeric matrix based on low density polyethylene (LDPE) and ethylene vinyl acetate (EVA). The materials have been prepared by extrusion: different procedures have been followed in order to obtain homogenous blends and uniform dispersion of the fillers. The chemical-physical materials properties have been investigated in order to determine the processing parameters relevant to the best material preparation procedure. The determination of the best processing method represents the first step to really evaluate the material potentialities and obtain a comprehensive knowledge on the effects of the nanofiller interactions with the blend matrix.
Keywords :
composite insulating materials; nanoparticles; polyethylene insulation; polymer blends; silicon compounds; LDPE-EVA blend; chemical-physical materials properties; ethylene vinyl acetate; homogenous blends; insulating materials; low density polyethylene; material preparation procedure; montmorillonite nanoparticles; nanofiller interactions; polyolefins; silica nanoparticles; thermoplastic polymers matrices; uniform filler dispersion; Dispersion; Electric breakdown; Films; Nanocomposites; Plastics; Silicon compounds;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on
Conference_Location :
Shenzhen
Type :
conf
DOI :
10.1109/CEIDP.2013.6748289
Filename :
6748289
Link To Document :
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