DocumentCode
685042
Title
Fault diagnosis system design of image motion compensation circuit for aerial camera
Author
Jie Duan ; Zhiyong An
Author_Institution
Coll. of Electron. Eng., Changchun Univ. of Sci. & Technol., Changchun, China
Volume
01
fYear
2013
fDate
16-18 Aug. 2013
Firstpage
657
Lastpage
660
Abstract
In order to solve fault diagnosis problems about process cumbersome, time-consuming, low operation efficiency due to its own characteristics of the image motion compensation circuit, the fault diagnosis system of image motion compensation circuit based on improved ant colony algorithm (ACO) and virtual instrument technology is designed. Aiming at established model after the detailed theoretical analysis, the real-time and automatic chip level testing to image motion compensation circuit can be realized, which not relying on any standard equipment and additional measuring points. All results of theoretical analysis and actual test to the designed fault diagnosis system shows that the fault coverage, average reliability and location rate to fault devices can reach 100%, 97.73% and 98% respectively. The characteristics of fast speed, high efficiency and high reliability in fault diagnosis show that the researched method can also be used for fault diagnosis of the other electronic equipment system.
Keywords
ant colony optimisation; automatic testing; cameras; circuit analysis computing; circuit testing; fault diagnosis; motion compensation; reliability; virtual instrumentation; ACO; aerial camera; ant colony algorithm; automatic chip level testing; average reliability; fault coverage; fault devices location rate; fault diagnosis system design; image motion compensation circuit; realtime chip level testing; virtual instrument technology; Analytical models; Atmospheric modeling; Cameras; Circuit faults; Reliability; Airborne Camera; Ant colony algorithm (ACO); fault diagnosis; image motion compensation circuit;
fLanguage
English
Publisher
ieee
Conference_Titel
Measurement, Information and Control (ICMIC), 2013 International Conference on
Conference_Location
Harbin
Print_ISBN
978-1-4799-1390-9
Type
conf
DOI
10.1109/MIC.2013.6758048
Filename
6758048
Link To Document