DocumentCode :
6854
Title :
Stretchable Electronics Technology for Large Area Applications: Fabrication and Mechanical Characterization
Author :
Bossuyt, Frederick ; Vervust, Thomas ; Vanfleteren, Jan
Author_Institution :
IMEC, Ghent Univ., Zwijnaarde, Belgium
Volume :
3
Issue :
2
fYear :
2013
fDate :
Feb. 2013
Firstpage :
229
Lastpage :
235
Abstract :
The development and mechanical characterization of a novel technology for stretchable electronics is presented, which can be used for the realization of wearable textile electronics and biomedical implants. The stretchable devices consist of rigid or flexible component islands interconnected with stretchable meander-shaped copper conductors embedded in a stretchable polymer, polydemethylsiloxane. The technology uses standard printed circuit board manufacturing steps and liquid injection molding techniques to achieve a robust and reliable product. The conductors in the device are designed to accommodate strains up to 10-15%. Spin-on photo-definable polyimide as mechanical support for the stretchable interconnects and the functional flexible islands are introduced. By use of polyimide, the reliability of the stretchable interconnects, the straight interconnects on the flexible islands and the transitions between the stretchable and nonstretchable parts are improved. Long-term endurance behavior of the stretchable interconnects is studied by cyclic elongation at strain ranges of up to 20% while monitoring the electrical connectivity. It´s shown that the lifetime of the polyimide supported interconnects is at least two times better compared to the nonsupported.
Keywords :
conductors (electric); elongation; flexible electronics; injection moulding; integrated circuit design; integrated circuit interconnections; integrated circuit reliability; polymers; printed circuit manufacture; prosthetics; supports; textile industry; biomedical implants; cyclic elongation; electrical connectivity; electronic circuit design; fabrication characterization; functional flexible islands; liquid injection molding techniques; mechanical characterization; mechanical support; polydemethylsiloxane; rigid component islands; spin-on photo-definable polyimide; standard printed circuit board manufacturing steps; stretchable electronics technology; stretchable interconnects reliability; stretchable meander-shaped copper conductors; stretchable polymer; wearable textile electronics; Conductors; Copper; Integrated circuit interconnections; Polyimides; Strain; Substrates; Cyclic endurance testing; polydimethylsiloxane (PDMS) moulding; stretchable electronics; stretchable interconnections;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2012.2185792
Filename :
6409498
Link To Document :
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