• DocumentCode
    6854
  • Title

    Stretchable Electronics Technology for Large Area Applications: Fabrication and Mechanical Characterization

  • Author

    Bossuyt, Frederick ; Vervust, Thomas ; Vanfleteren, Jan

  • Author_Institution
    IMEC, Ghent Univ., Zwijnaarde, Belgium
  • Volume
    3
  • Issue
    2
  • fYear
    2013
  • fDate
    Feb. 2013
  • Firstpage
    229
  • Lastpage
    235
  • Abstract
    The development and mechanical characterization of a novel technology for stretchable electronics is presented, which can be used for the realization of wearable textile electronics and biomedical implants. The stretchable devices consist of rigid or flexible component islands interconnected with stretchable meander-shaped copper conductors embedded in a stretchable polymer, polydemethylsiloxane. The technology uses standard printed circuit board manufacturing steps and liquid injection molding techniques to achieve a robust and reliable product. The conductors in the device are designed to accommodate strains up to 10-15%. Spin-on photo-definable polyimide as mechanical support for the stretchable interconnects and the functional flexible islands are introduced. By use of polyimide, the reliability of the stretchable interconnects, the straight interconnects on the flexible islands and the transitions between the stretchable and nonstretchable parts are improved. Long-term endurance behavior of the stretchable interconnects is studied by cyclic elongation at strain ranges of up to 20% while monitoring the electrical connectivity. It´s shown that the lifetime of the polyimide supported interconnects is at least two times better compared to the nonsupported.
  • Keywords
    conductors (electric); elongation; flexible electronics; injection moulding; integrated circuit design; integrated circuit interconnections; integrated circuit reliability; polymers; printed circuit manufacture; prosthetics; supports; textile industry; biomedical implants; cyclic elongation; electrical connectivity; electronic circuit design; fabrication characterization; functional flexible islands; liquid injection molding techniques; mechanical characterization; mechanical support; polydemethylsiloxane; rigid component islands; spin-on photo-definable polyimide; standard printed circuit board manufacturing steps; stretchable electronics technology; stretchable interconnects reliability; stretchable meander-shaped copper conductors; stretchable polymer; wearable textile electronics; Conductors; Copper; Integrated circuit interconnections; Polyimides; Strain; Substrates; Cyclic endurance testing; polydimethylsiloxane (PDMS) moulding; stretchable electronics; stretchable interconnections;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2012.2185792
  • Filename
    6409498