• DocumentCode
    686197
  • Title

    A dynamic and mixed routing algorithm for 2D mesh NoC

  • Author

    Gaoming Du ; Dayi Liang ; Yukun Song ; Duoli Zhang

  • Author_Institution
    Inst. of VLSI Design, Hefei Univ. of Technol., Hefei, China
  • fYear
    2013
  • fDate
    25-27 Oct. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    To solve the congestion of NoC caused by overload such as injection rate increase, this paper proposes a novel routing algorithm, that is Dynamic and Mixed Routing(MIXROUT) which is based on XY Routing(XY) and Multiple and Load-Balance Path Routing(MULTI). Although MULTI is an adaptive routing that can relieve traffic congestion state, it has a higher operating power and temperature than other routing mechanism. So a dynamic routing strategy is proposed on the status of the network. It works as follows: MULTI is selected as the routing algorithm when NoC is in heavy load state, otherwise XY is chosen for a lower operating power and temperature. Experimental results show that under the condition of 4*4 topology sizes, MIXROUT is better than XY and MULTI used singly in term of thermal gradient, with a value 1.882°C, 4.116°C and 4.542°C respectively.
  • Keywords
    low-power electronics; network routing; network-on-chip; resource allocation; topology; 2D mesh NoC; MIXROUT; MULTI; Multiple and Load-Balance Path Routing; NoC congestion; XY Routing; adaptive routing; dynamic routing algorithm; dynamic routing strategy; injection rate; mixed routing algorithm; operating power; overload; routing mechanism; temperature; temperature 1.882 degC; temperature 4.116 degC; temperature 4.542 degC; thermal gradient; topology size; traffic congestion state; Algorithm design and analysis; Heuristic algorithms; Load modeling; Network topology; Routing; Throughput; Topology; Dynamic routing algorithm; Power; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Anti-Counterfeiting, Security and Identification (ASID), 2013 IEEE International Conference on
  • Conference_Location
    Shanghai
  • Type

    conf

  • DOI
    10.1109/ICASID.2013.6825285
  • Filename
    6825285