DocumentCode :
686205
Title :
A high precision CMOS band-gap reference with exponential curvature-compensation
Author :
Yongsheng Yin ; Dewu Li ; Honghui Deng
Author_Institution :
Inst. of VLSI Design, Hefei Univ. of Technol., Hefei, China
fYear :
2013
fDate :
25-27 Oct. 2013
Firstpage :
1
Lastpage :
5
Abstract :
An exponential curvature compensation technique for the high precision band-gap reference (BGR) is presented in this paper, in order to reduce the temperature coefficient (TC) of the traditional band-gap reference, the circuit exploits the temperature characteristics of the current gain ß of BJTs, and generates the current which has non-linear relationship with the temperature to compensate for the higher-order term of the BGR. The compensation circuit adopts a different bipolar current mirror, which can reduce the current error greatly, and the use of native nmos instead of bipolar makes the BGR worked normally under a relatively low supply voltage and the MOST mirrored current can be more accurate. The whole BGR circuits are simulated by Spectre based on chartered 0.18μm 1P5M 1.8V CMOS technology. The simulation shows the temperature coefficient of the output voltage reaches 1.85ppm/K over the military temperature range of -40°C to +125°C, the Power Supply Rejection Ratio (PSRR) of the reference voltage achieves 58.8dB at low frequency(f=0.1Hz), the settling time is 370 ns and the band-gap reference can work normally in all process corners.
Keywords :
CMOS integrated circuits; bipolar transistors; current mirrors; exponential distribution; BJT; CMOS technology; bipolar current mirror; exponential curvature compensation; frequency 0.1 Hz; high precision CMOS bandgap reference; power supply rejection ratio; size 0.18 mum; temperature -40 degC to 125 degC; temperature coefficient; time 370 ns; voltage 1.8 V; CMOS integrated circuits; MOS devices; Mirrors; Photonic band gap; Power supplies; Temperature distribution; Band-gap reference; Exponential curvature compensation; Settling time; Temperature coefficient;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Anti-Counterfeiting, Security and Identification (ASID), 2013 IEEE International Conference on
Conference_Location :
Shanghai
Type :
conf
DOI :
10.1109/ICASID.2013.6825293
Filename :
6825293
Link To Document :
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