Title :
A Hybrid Implicit–Explicit and Conformal (HIE/C) FDTD Method for Efficient Electromagnetic Simulation of Nonorthogonally Aligned Thin Structures
Author :
Muraoka, Hideaki ; Inoue, Yuta ; Sekine, Tadatoshi ; Asai, Hideki
Author_Institution :
Dept. of Syst. Eng., Shizuoka Univ., Hamamatsu, Japan
Abstract :
In a conventional finite-difference time-domain (FDTD) method, the computational cost increases as a grid spacing decreases because the number of unknowns increases and a time step size decreases to fulfill a numerical stability condition. Especially, it is inherently time-consuming to analyze thin structures such as a printed circuit board (PCB) and nonorthogonally aligned objects such as interconnection patterns on the PCB. In this paper, we propose an efficient electromagnetic simulation technique which is constructed by combining a hybrid implicit-explicit (HIE)-FDTD method and a conformal FDTD (CFDTD) method. The proposed technique can avoid the aforementioned problems by exploiting advantages of the HIE-FDTD and CFDTD methods. An example model of the interconnection pattern on the PCB is analyzed by the proposed and conventional methods, and we compare their accuracy and efficiency.
Keywords :
finite difference time-domain analysis; numerical stability; printed circuit interconnections; HIE/C FDTD method; PCB; computational cost; electromagnetic simulation technique; finite-difference time-domain method; grid spacing; hybrid implicit-explicit and conformal FDTD method; interconnection pattern; interconnection patterns; nonorthogonally aligned objects; nonorthogonally aligned thin structures; numerical stability condition; printed circuit board; time step size; Finite difference methods; Mathematical model; Matrices; Modeling; Numerical stability; Time-domain analysis; Conformal finite-difference time-domain (CFDTD) method; finite-difference time-domain (FDTD) method; hybrid implicit–explicit finite-difference time-domain (HIE-FDTD) method; subcell;
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
DOI :
10.1109/TEMC.2013.2273852