DocumentCode :
68635
Title :
High-performance stacked-coil transformers with thick metal layers
Author :
Cheol Ho Kim ; Bonghyuk Park
Author_Institution :
Electron. & Telecommun. Res. Inst., Daejeon, South Korea
Volume :
50
Issue :
19
fYear :
2014
fDate :
September 11 2014
Firstpage :
1359
Lastpage :
1361
Abstract :
Miniaturised stacked-coil radio-frequency (RF) transformers were fabricated with thick metal layers using the low-cost anodised aluminium substrate process. The transformer consists of a 34 μm-thick substrate-buried copper lower coil and a 30 μm-thick copper/gold upper coil with a 3 μm-thick benzocyclobutene (BCB) interlayer between the coils. Owing to extremely low losses and tight coupling, the fabricated transformers achieved very low insertion losses as low as 0.28 dB and high maximum available gains of up to 0.96 at GHz frequencies. The results verify that the stacked-coil transformer with thick metal layers can be a promising component for high-performance miniaturised RF circuits.
Keywords :
coils; high-frequency transformers; substrates; BCB interlayer; benzocyclobutene interlayer; copper-gold upper coil; high-performance miniaturised RF circuits; low-cost anodised aluminium substrate process; miniaturised stacked-coil RF transformers; miniaturised stacked-coil radio-frequency transformers; size 3 mum; size 34 mum; substrate-buried copper lower coil; thick metal layers;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el.2014.2502
Filename :
6898647
Link To Document :
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