DocumentCode
687094
Title
A 20-ps temperature compensated Time-to-Digital Converter (TDC) implemented in FPGA
Author
Weibin Pan ; Guanghua Gong ; Hongming Li ; Jianmin Li
Author_Institution
Dept. of Eng. Phys., Tsinghua Univ., Beijing, China
fYear
2013
fDate
Oct. 27 2013-Nov. 2 2013
Firstpage
1
Lastpage
6
Abstract
This paper presents a temperature compensation design for carry chain based Time-to-Digital Converter (TDC) in FPGA. The bin-by-bin calibrations under different temperatures are performed for both plain TDC and Wave Union TDC to characterize the influence of temperature variation on the delay time of carry chain which shows all TDC channels have the similar temperature-LUT coefficient. Accordingly, a simplified temperature compensation scheme by using a dedicated correction channel to measure the coefficient and correct fine time result for all TDC channels is implemented and tested. This method shows only few picosecond errors for both simulation and measurement. With this compensation approach, a 21ps RMS TDC resolution has been achieved in Cyclone II FPGA under a wide temperature range from 10°C to 75°C. Several design key points are also described in this paper.
Keywords
compensation; delays; field programmable gate arrays; integrated circuit layout; table lookup; thermal analysis; time-digital conversion; Cyclone II FPGA; RMS TDC resolution; TDC channels; bin-by-bin calibrations; carry chain; correct fine time result; correction channel; delay time; look-up table; picosecond errors; temperature 10 degC to 75 degC; temperature compensated time-to-digital converter; temperature compensation design; temperature compensation scheme; temperature-LUT coefficient; time 10 ps; time 21 ps; wave union TDC; Calibration; Clocks; Delays; Field programmable gate arrays; Table lookup; Temperature distribution; Temperature measurement; field-programmable gate array (FPGA); temperature compensation; time-to-digital converter;
fLanguage
English
Publisher
ieee
Conference_Titel
Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC), 2013 IEEE
Conference_Location
Seoul
Print_ISBN
978-1-4799-0533-1
Type
conf
DOI
10.1109/NSSMIC.2013.6829535
Filename
6829535
Link To Document