Upgrades of the HL-LHC/ATLAS hybrid pixels detector: Test results of the first 3D-IC prototype

Vertex detectors for High Energy Physic experiments require pixel detectors featuring high spatial resolution, very good signal to noise ratio and radiation hardness. A way to face new challenges of the upgrades of HL-LHC/ATLAS future hybrid pixel vertex detectors is to use the emerging 3D Integrated Technologies. However, commercial offers of such technologies are only very few and the 3D designer´s choice is then very much constrained. Moreover, as radiation hardness and in particular SEU tolerance of configuration registers is a crucial issue for HL-LHC vertex detectors and, as commercial data on this point are always missing, a reliable qualification program is to be developed for any candidate technology. We will present the test results of GlobalFoundries, 130 nm chips processed by Tezzaron Company, submitted within the 3D-IC consortium. Reliability and influence of these 3D connections on integrated devices behavior has also been addressed by tests.