DocumentCode :
687226
Title :
Upgrades of the HL-LHC/ATLAS hybrid pixels detector: Test results of the first 3D-IC prototype
Author :
Pangaud, Patrick ; Arutinov, David ; Barbero, Marlon ; Bompard, Frederic ; Breugnon, Patrick ; Clemens, Jean-Claude ; Fougeron, Denis ; Garcia-Sciveres, Maurice ; Godiot, Stephanie ; Hemperek, Tomaz ; Kruger, Heinrich ; Jian Liu ; Obermann, Theresa ; Roza
Author_Institution :
Centre de Phys. des Particules de Marseille, Univ. de la Mediterranee Aix-Marseille II, Marseille, France
fYear :
2013
fDate :
Oct. 27 2013-Nov. 2 2013
Firstpage :
1
Lastpage :
4
Abstract :
Vertex detectors for High Energy Physic experiments require pixel detectors featuring high spatial resolution, very good signal to noise ratio and radiation hardness. A way to face new challenges of the upgrades of HL-LHC/ATLAS future hybrid pixel vertex detectors is to use the emerging 3D Integrated Technologies. However, commercial offers of such technologies are only very few and the 3D designer´s choice is then very much constrained. Moreover, as radiation hardness and in particular SEU tolerance of configuration registers is a crucial issue for HL-LHC vertex detectors and, as commercial data on this point are always missing, a reliable qualification program is to be developed for any candidate technology. We will present the test results of GlobalFoundries, 130 nm chips processed by Tezzaron Company, submitted within the 3D-IC consortium. Reliability and influence of these 3D connections on integrated devices behavior has also been addressed by tests.
Keywords :
nuclear electronics; position sensitive particle detectors; radiation hardening (electronics); reliability; semiconductor counters; three-dimensional integrated circuits; tolerance analysis; 3D Integrated Technologies; 3D connections; 3D designer choice; 3D-IC consortium; 3D-IC prototype; GlobalFoundries; HL-LHC/ATLAS future hybrid pixel vertex detectors; High Energy Physic experiments; SEU tolerance; Tezzaron Company; chips; commercial data; configuration registers; high spatial resolution; integrated device behavior; radiation hardness; reliability; reliable qualification program; signal-to-noise ratio; Detectors; Integrated circuit interconnections; Metals; Physics; Prototypes; Three-dimensional displays; Through-silicon vias;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC), 2013 IEEE
Conference_Location :
Seoul
Print_ISBN :
978-1-4799-0533-1
Type :
conf
DOI :
10.1109/NSSMIC.2013.6829672
Filename :
6829672
Link To Document :
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