DocumentCode
688630
Title
Direct joining and welding with ultrashort laser pulses
Author
Watanabe, Wataru
Author_Institution
Dept. of Electr. & Electron. Eng., Ritsumeikan Univ., Kusatsu, Japan
fYear
2013
fDate
9-14 June 2013
Firstpage
1
Lastpage
2
Abstract
Ultrashort laser pulses can be used to directly join transparent substrates by localized melting and resolidification without any intermediate layers. I review recent advance of welding and joining of glass substrates with ultrashort laser pulses.
Keywords
glass; high-speed optical techniques; joining processes; laser beam welding; melting; solidification; direct joining; glass substrates; laser welding; localized melting; resolidification; transparent substrates; ultrashort laser pulses; Fiber lasers; Laser applications; Optical pulse generation; Substrates; Welding;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics (CLEO), 2013 Conference on
Conference_Location
San Jose, CA
Type
conf
Filename
6833005
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