Title :
Direct joining and welding with ultrashort laser pulses
Author :
Watanabe, Wataru
Author_Institution :
Dept. of Electr. & Electron. Eng., Ritsumeikan Univ., Kusatsu, Japan
Abstract :
Ultrashort laser pulses can be used to directly join transparent substrates by localized melting and resolidification without any intermediate layers. I review recent advance of welding and joining of glass substrates with ultrashort laser pulses.
Keywords :
glass; high-speed optical techniques; joining processes; laser beam welding; melting; solidification; direct joining; glass substrates; laser welding; localized melting; resolidification; transparent substrates; ultrashort laser pulses; Fiber lasers; Laser applications; Optical pulse generation; Substrates; Welding;
Conference_Titel :
Lasers and Electro-Optics (CLEO), 2013 Conference on
Conference_Location :
San Jose, CA
