• DocumentCode
    689114
  • Title

    High-density silicon optical interposer for inter-chip interconnects based on compact and high speed components

  • Author

    Nakamura, T. ; Urino, Yutaka ; Fujikata, J. ; Usuki, Tatsuya ; Ishizaka, Masashige ; Yamada, Koji ; Horikawa, Tsuyoshi ; Arakawa, Yasuhiko

  • Author_Institution
    Inst. for Photonics-Electron. Convergence Syst. Technol. (PECST), Tsukuba, Japan
  • fYear
    2013
  • fDate
    9-14 June 2013
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    By integrating compact and high-speed silicon modulators and germanium photodiodes with light sources, we demonstrated a silicon optical interposer for inter-chip interconnects with a bandwidth density of 6.6 Tbps/cm2.
  • Keywords
    germanium; integrated optics; integrated optoelectronics; light sources; optical interconnections; optical modulation; photodiodes; silicon; Ge; Si; bandwidth density; compact silicon modulators; germanium photodiodes; high-density silicon optical interposer; high-speed silicon modulators; inter-chip interconnects; light sources; Adaptive optics; High-speed optical techniques; Optical device fabrication; Optical modulation; Optical waveguides; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics (CLEO), 2013 Conference on
  • Conference_Location
    San Jose, CA
  • Type

    conf

  • Filename
    6833496
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=689114