DocumentCode :
689114
Title :
High-density silicon optical interposer for inter-chip interconnects based on compact and high speed components
Author :
Nakamura, T. ; Urino, Yutaka ; Fujikata, J. ; Usuki, Tatsuya ; Ishizaka, Masashige ; Yamada, Koji ; Horikawa, Tsuyoshi ; Arakawa, Yasuhiko
Author_Institution :
Inst. for Photonics-Electron. Convergence Syst. Technol. (PECST), Tsukuba, Japan
fYear :
2013
fDate :
9-14 June 2013
Firstpage :
1
Lastpage :
2
Abstract :
By integrating compact and high-speed silicon modulators and germanium photodiodes with light sources, we demonstrated a silicon optical interposer for inter-chip interconnects with a bandwidth density of 6.6 Tbps/cm2.
Keywords :
germanium; integrated optics; integrated optoelectronics; light sources; optical interconnections; optical modulation; photodiodes; silicon; Ge; Si; bandwidth density; compact silicon modulators; germanium photodiodes; high-density silicon optical interposer; high-speed silicon modulators; inter-chip interconnects; light sources; Adaptive optics; High-speed optical techniques; Optical device fabrication; Optical modulation; Optical waveguides; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Lasers and Electro-Optics (CLEO), 2013 Conference on
Conference_Location :
San Jose, CA
Type :
conf
Filename :
6833496
Link To Document :
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