DocumentCode
689428
Title
Backside surface machining of silicon wafers using a nanosecond Tm:Fiber MOPA system
Author
Shah, Lawrence ; Bonhoff, Tobias ; El-Sherif, Ashraf F. ; Kadwani, Pankaj ; Gebhardt, Martin ; Gaida, Christian ; Migareev, Ilya ; Richardson, Mark
Author_Institution
Coll. of Opt. & Photonics, CREOL, Orlando, FL, USA
fYear
2013
fDate
9-14 June 2013
Firstpage
1
Lastpage
2
Abstract
We report on selective machining of the back surface machining of double-side polished silicon wafers, using a high peak power nanosecond Tm:fiber master oscillator power amplifier with a photonic crystal fiber based power amplifier.
Keywords
elemental semiconductors; holey fibres; laser beam machining; laser materials processing; optical fibre amplifiers; photonic crystals; polishing; power amplifiers; silicon; thulium; Si; backside surface machining; double-side polished silicon wafers; master oscillator power amplifier; nanosecond Tm:fiber MOPA system; photonic crystal fiber; Fiber lasers; Machining; Optical surface waves; Silicon; Surface emitting lasers; Surface morphology;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics (CLEO), 2013 Conference on
Conference_Location
San Jose, CA
Type
conf
Filename
6833812
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