Title :
Multifunction Behavior of a Vertical MOSFET With Trench Body Structure and New Erase Mechanism for Use in 1T-DRAM
Author :
Jyi-Tsong Lin ; Po-Hsieh Lin
Author_Institution :
Dept. of Electr. Eng., Nat. Sun Yat-sen Univ., Kaohsiung, Taiwan
Abstract :
A multifunctional vertical silicon-on-insulator-based metal-oxide-semiconductor (VSoI-MOS) field-effect transistor with trench body structure was designed. It can act as a high-performance transistor (HPT) or a capacitorless one-transistor dynamic random access memory (1T-DRAM), depending on the drain/source location and its electrical and transient performances. The VSoI-MOS operated in HPT mode exhibits favorable electrical performance with a lower drain-induced barrier lowering and subthreshold swing; the same device when operated in the 1T-DRAM mode exhibits a clear kink effect in its output characteristics, which facilitates the appearance of floating body effect and a significant improvement in the transient characteristics compared with HPT mode. This paper proposes a new erase mechanism for the 1T-DRAM mode. The mechanism is studied in detail by exploiting the self-heating of holes.
Keywords :
DRAM chips; MOSFET; field effect transistors; silicon-on-insulator; 1T-DRAM; HPT; VSoI-MOS field-effect transistor; capacitorless one-transistor dynamic random access memory; drain-source location; electrical performance; floating body effect; high-performance transistor; hole self-heating; kink effect; lower drain-induced barrier; multifunction behavior; multifunctional vertical silicon-on-insulator-based metal-oxide-semiconductor field-effect transistor; new erase mechanism; subthreshold swing; transient characteristics; transient performance; trench body structure; vertical MOSFET; Body regions; Impact ionization; Performance evaluation; Silicon; Temperature; Transient analysis; Transistors; Capacitorless one-transistor dynamic random access memory (1T-DRAM); multifunction; silicon-on-insulator (SoI) technology; trench body structure;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2014.2336533